Universal block copolymer lithography for metals, semiconductors, ceramics, and polymers

A universal block copolymer lithography process was introduced for arbitrary functional materials such as metals, semiconductors, ceramics, and polymers. A functional substrate with uniform thickness was deposited on a silicon substrate by sputtering, chemical vapor deposition (CVD), sol-gel-casting, or atomic layer deposition (ALD). The water contact angle upon as-deposited film surface ranged from 40° to 80°, decreasing to only a few degrees after pretreatment process. SEM images show that nanotemplate consisting of surface perpendicular PMMA cylinders is polystyrene (PS) matrix assisted upon a TiO₂ substrate. The large surface area of the nanoporous TiO₂ is expected to provide an improved photocatalytic property, while Pt nanowires are applicable to the conductive wires for electronic devices.