TRANSFORMATION of 2D PLANES into 3D SOFT STRUCTURES with ELECTRICAL FUNCTIONS

Hyunmin Moon; Byungwook Park; Sohee Kim

doi:10.1109/Transducers50396.2021.9495560

TRANSFORMATION of 2D PLANES into 3D SOFT STRUCTURES with ELECTRICAL FUNCTIONS

Hyunmin Moon, Byungwook Park, Sohee Kim

Department of Robotics and Mechatronics Engineering

Daegu Gyeongbuk Institute of Science and Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

3-dimensional (3D) structures composed of flexible and soft materials have been in demand for bio-integrated devices. However, the fabrication of 3D structures using micro electro mechanical systems (MEMS) techniques has limitations in terms of commonly used inorganic materials and the microscale of resulted structures. Here, we developed a novel technique to selectively bond polydimethylsiloxane (PDMS) and parylene C by plasma treatment, with which 2D structures fabricated using conventional MEMS techniques are transformed into 3D structures by the inflation of selectively non-bonded patterns. We demonstrated various soft and flexible 3D devices with embedded electrical functions for biomedical applications.

Original language	English
Title of host publication	21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1-3
Number of pages	3
ISBN (Electronic)	9781665412674
DOIs	https://doi.org/10.1109/Transducers50396.2021.9495560
State	Published - 20 Jun 2021
Event	21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021 - Virtual, Online, United States Duration: 20 Jun 2021 → 25 Jun 2021

Publication series

Name	21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021

Conference

Conference	21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
Country/Territory	United States
City	Virtual, Online
Period	20/06/21 → 25/06/21

Bibliographical note

Publisher Copyright:
© 2021 IEEE.

Keywords

3D structures
bio-integrated electronics
crack-free electrodes
flexible electronics
soft electronics

Access to Document

10.1109/Transducers50396.2021.9495560

Cite this

Moon, H., Park, B., & Kim, S. (2021). TRANSFORMATION of 2D PLANES into 3D SOFT STRUCTURES with ELECTRICAL FUNCTIONS. In 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021 (pp. 1-3). (21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/Transducers50396.2021.9495560

Moon, Hyunmin ; Park, Byungwook ; Kim, Sohee. / TRANSFORMATION of 2D PLANES into 3D SOFT STRUCTURES with ELECTRICAL FUNCTIONS. 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021. Institute of Electrical and Electronics Engineers Inc., 2021. pp. 1-3 (21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021).

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abstract = "3-dimensional (3D) structures composed of flexible and soft materials have been in demand for bio-integrated devices. However, the fabrication of 3D structures using micro electro mechanical systems (MEMS) techniques has limitations in terms of commonly used inorganic materials and the microscale of resulted structures. Here, we developed a novel technique to selectively bond polydimethylsiloxane (PDMS) and parylene C by plasma treatment, with which 2D structures fabricated using conventional MEMS techniques are transformed into 3D structures by the inflation of selectively non-bonded patterns. We demonstrated various soft and flexible 3D devices with embedded electrical functions for biomedical applications.",

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Moon, H, Park, B & Kim, S 2021, TRANSFORMATION of 2D PLANES into 3D SOFT STRUCTURES with ELECTRICAL FUNCTIONS. in 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021. 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021, Institute of Electrical and Electronics Engineers Inc., pp. 1-3, 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021, Virtual, Online, United States, 20/06/21. https://doi.org/10.1109/Transducers50396.2021.9495560

TRANSFORMATION of 2D PLANES into 3D SOFT STRUCTURES with ELECTRICAL FUNCTIONS. / Moon, Hyunmin; Park, Byungwook; Kim, Sohee.
21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021. Institute of Electrical and Electronics Engineers Inc., 2021. p. 1-3 (21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - 3-dimensional (3D) structures composed of flexible and soft materials have been in demand for bio-integrated devices. However, the fabrication of 3D structures using micro electro mechanical systems (MEMS) techniques has limitations in terms of commonly used inorganic materials and the microscale of resulted structures. Here, we developed a novel technique to selectively bond polydimethylsiloxane (PDMS) and parylene C by plasma treatment, with which 2D structures fabricated using conventional MEMS techniques are transformed into 3D structures by the inflation of selectively non-bonded patterns. We demonstrated various soft and flexible 3D devices with embedded electrical functions for biomedical applications.

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KW - bio-integrated electronics

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Moon H, Park B, Kim S. TRANSFORMATION of 2D PLANES into 3D SOFT STRUCTURES with ELECTRICAL FUNCTIONS. In 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021. Institute of Electrical and Electronics Engineers Inc. 2021. p. 1-3. (21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021). doi: 10.1109/Transducers50396.2021.9495560

TRANSFORMATION of 2D PLANES into 3D SOFT STRUCTURES with ELECTRICAL FUNCTIONS

Abstract

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Keywords

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