Thermal impact of an active 3-D microelectrode array implanted in the brain

Sohee Kim; Prashant Tathireddy; Richard A. Normann; Florian Solzbacher

doi:10.1109/TNSRE.2007.908429

Thermal impact of an active 3-D microelectrode array implanted in the brain

Sohee Kim, Prashant Tathireddy, Richard A. Normann, Florian Solzbacher

Department of Robotics and Mechatronics Engineering

University of Utah

Research output: Contribution to journal › Article › peer-review

170 Scopus citations

Abstract

A chronically implantable, wireless neural interface device will require integrating electronic circuitry with the interfacing microelectrodes in order to eliminate wired connections. Since the integrated circuit (IC) dissipates a certain amount of power, it will raise the temperature in surrounding tissues where it is implanted. In this paper, the thermal influence of the integrated 3-D Utah electrode array (UEA) device implanted in the brain was investigated by numerical simulation using finite element analysis (FEA) and by experimental measurement in vitro as well as in vivo. The numerically calculated and experimentally measured temperature increases due to the UEA implantation were in good agreement. The experimentally validated numerical model predicted that the temperature increases linearly with power dissipation through the UEA, with a slope of 0.029°C/mW over the power dissipation levels expected to be used. The influences of blood perfusion, brain metabolism, and UEA geometry on tissue heating were also investigated using the numerical model.

Original language	English
Pages (from-to)	493-501
Number of pages	9
Journal	IEEE Transactions on Neural Systems and Rehabilitation Engineering
Volume	15
Issue number	4
DOIs	https://doi.org/10.1109/TNSRE.2007.908429
State	Published - Dec 2007

Bibliographical note

Funding Information:
Manuscript received January 26, 2007; revised July 2, 2007; accepted August 11, 2007. This work was supported in part by NIH/NINDS Contract HHSN265200423621C and by DARPA under Contract N66001-06-C-8005. S. Kim and P. Tathireddy are with the Department of Electrical and Computer Engineering, University of Utah, Salt Lake City, UT 84112 USA (e-mail: [email protected]; [email protected]). R. A. Normann is with the Department of Bioengineering, University of Utah, Salt Lake City, UT 84112 USA (e-mail: [email protected]). F. Solzbacher is with the Department of Electrical and Computer Engineering and the Department of Bioengineering, University of Utah, Salt Lake City, UT 84112 USA (e-mail: [email protected]). Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TNSRE.2007.908429

Keywords

Finite element analysis (FEA)
Microelectrode
Neural interface
Neuroprosthesis
Temperature increase
Thermal impact
Utah electrode array (UEA)

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10.1109/TNSRE.2007.908429

Cite this

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title = "Thermal impact of an active 3-D microelectrode array implanted in the brain",

abstract = "A chronically implantable, wireless neural interface device will require integrating electronic circuitry with the interfacing microelectrodes in order to eliminate wired connections. Since the integrated circuit (IC) dissipates a certain amount of power, it will raise the temperature in surrounding tissues where it is implanted. In this paper, the thermal influence of the integrated 3-D Utah electrode array (UEA) device implanted in the brain was investigated by numerical simulation using finite element analysis (FEA) and by experimental measurement in vitro as well as in vivo. The numerically calculated and experimentally measured temperature increases due to the UEA implantation were in good agreement. The experimentally validated numerical model predicted that the temperature increases linearly with power dissipation through the UEA, with a slope of 0.029°C/mW over the power dissipation levels expected to be used. The influences of blood perfusion, brain metabolism, and UEA geometry on tissue heating were also investigated using the numerical model.",

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note = "Funding Information: Manuscript received January 26, 2007; revised July 2, 2007; accepted August 11, 2007. This work was supported in part by NIH/NINDS Contract HHSN265200423621C and by DARPA under Contract N66001-06-C-8005. S. Kim and P. Tathireddy are with the Department of Electrical and Computer Engineering, University of Utah, Salt Lake City, UT 84112 USA (e-mail: [email protected]; [email protected]). R. A. Normann is with the Department of Bioengineering, University of Utah, Salt Lake City, UT 84112 USA (e-mail: [email protected]). F. Solzbacher is with the Department of Electrical and Computer Engineering and the Department of Bioengineering, University of Utah, Salt Lake City, UT 84112 USA (e-mail: [email protected]). Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TNSRE.2007.908429",

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Thermal impact of an active 3-D microelectrode array implanted in the brain

Abstract

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Keywords

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