Abstract
Through combined experimental and theoretical investigations, it was shown that N adsorption occurs extraordinarily. Such characteristic N incorporation may also explain the mechanism of the SiOxNy/Si(100) interface formation with N-rich Si layers. This result shows a possibility of new low-temperature process design for ultrathin oxynitride/nitride dielectric layers.
| Original language | English |
|---|---|
| Article number | 106101 |
| Pages (from-to) | 106101/1-106101/4 |
| Journal | Physical Review Letters |
| Volume | 90 |
| Issue number | 10 |
| State | Published - 14 Mar 2003 |
Bibliographical note
Funding Information:This work is supported by KOSEF through ASSRC and Tera-level Nano Device project of 21 Century Frontier program. PAL is supported by MOST and POSCO.
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