Soft and Flexible 3D-Structured Device with Crack-Free Metal Patterns

Hyunmin Moon; Sohee Kim

doi:10.1109/MEMS46641.2020.9056341

Soft and Flexible 3D-Structured Device with Crack-Free Metal Patterns

Hyunmin Moon, Sohee Kim

Department of Robotics and Mechatronics Engineering

Daegu Gyeongbuk Institute of Science and Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

This paper proposes a fabrication technique of 3-dimensional (3D) soft and flexible devices with embedded crack-free metal patterns. After the selective bonding between PDMS and parylene-C, additional MEMS techniques such as patterning of conductive lines and pads can be processed on a 2D plane before the transformation into a 3D structure. Moreover, the fabrication processes have been optimized to achieve crack-free metal patterns, because the microcracks in metal patterns could affect the electrical connections and the life-time of soft and flexible devices. Based on the advantageous material characteristics such as flexibility, softness, and biocompatibility, the 3D-structured devices are expected to be used as implantable biomedical devices for various prospective applications.

Original language	English
Title of host publication	33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	245-248
Number of pages	4
ISBN (Electronic)	9781728135809
DOIs	https://doi.org/10.1109/MEMS46641.2020.9056341
State	Published - Jan 2020
Event	33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020 - Vancouver, Canada Duration: 18 Jan 2020 → 22 Jan 2020

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume	2020-January
ISSN (Print)	1084-6999

Conference

Conference	33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
Country/Territory	Canada
City	Vancouver
Period	18/01/20 → 22/01/20

Bibliographical note

Publisher Copyright:
© 2020 IEEE.

Keywords

PDMS
crack-free metal patterns
parylene-C
selective bonding
soft and flexible 3D structure

Access to Document

10.1109/MEMS46641.2020.9056341

Cite this

Moon, H., & Kim, S. (2020). Soft and Flexible 3D-Structured Device with Crack-Free Metal Patterns. In 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020 (pp. 245-248). Article 9056341 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2020-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMS46641.2020.9056341

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title = "Soft and Flexible 3D-Structured Device with Crack-Free Metal Patterns",

abstract = "This paper proposes a fabrication technique of 3-dimensional (3D) soft and flexible devices with embedded crack-free metal patterns. After the selective bonding between PDMS and parylene-C, additional MEMS techniques such as patterning of conductive lines and pads can be processed on a 2D plane before the transformation into a 3D structure. Moreover, the fabrication processes have been optimized to achieve crack-free metal patterns, because the microcracks in metal patterns could affect the electrical connections and the life-time of soft and flexible devices. Based on the advantageous material characteristics such as flexibility, softness, and biocompatibility, the 3D-structured devices are expected to be used as implantable biomedical devices for various prospective applications.",

keywords = "PDMS, crack-free metal patterns, parylene-C, selective bonding, soft and flexible 3D structure",

author = "Hyunmin Moon and Sohee Kim",

note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020 ; Conference date: 18-01-2020 Through 22-01-2020",

year = "2020",

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doi = "10.1109/MEMS46641.2020.9056341",

language = "English",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

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Moon, H & Kim, S 2020, Soft and Flexible 3D-Structured Device with Crack-Free Metal Patterns. in 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020., 9056341, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), vol. 2020-January, Institute of Electrical and Electronics Engineers Inc., pp. 245-248, 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020, Vancouver, Canada, 18/01/20. https://doi.org/10.1109/MEMS46641.2020.9056341

Soft and Flexible 3D-Structured Device with Crack-Free Metal Patterns. / Moon, Hyunmin; Kim, Sohee.
33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020. Institute of Electrical and Electronics Engineers Inc., 2020. p. 245-248 9056341 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2020-January).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - This paper proposes a fabrication technique of 3-dimensional (3D) soft and flexible devices with embedded crack-free metal patterns. After the selective bonding between PDMS and parylene-C, additional MEMS techniques such as patterning of conductive lines and pads can be processed on a 2D plane before the transformation into a 3D structure. Moreover, the fabrication processes have been optimized to achieve crack-free metal patterns, because the microcracks in metal patterns could affect the electrical connections and the life-time of soft and flexible devices. Based on the advantageous material characteristics such as flexibility, softness, and biocompatibility, the 3D-structured devices are expected to be used as implantable biomedical devices for various prospective applications.

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KW - crack-free metal patterns

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Moon H, Kim S. Soft and Flexible 3D-Structured Device with Crack-Free Metal Patterns. In 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020. Institute of Electrical and Electronics Engineers Inc. 2020. p. 245-248. 9056341. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMS46641.2020.9056341

Soft and Flexible 3D-Structured Device with Crack-Free Metal Patterns

Abstract

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Keywords

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