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Self-assembled three dimensional network designs for soft electronics
Kyung In Jang, Kan Li, Ha Uk Chung, Sheng Xu, Han Na Jung, Yiyuan Yang, Jean Won Kwak, Han Hee Jung, Juwon Song, Ce Yang, Ao Wang, Zhuangjian Liu, Jong Yoon Lee, Bong Hoon Kim, Jae Hwan Kim, Jungyup Lee, Yongjoon Yu, Bum Jun Kim, Hokyung Jang, Ki Jun Yu
- Northwestern University
- University of Illinois at Urbana-Champaign
- University of California at San Diego
- Daegu Gyeongbuk Institute of Science and Technology
- Tsinghua University
- Agency for Science, Technology and Research, Singapore
- Yonsei University
- Kwangwoon University
- Pusan National University
- Department of Mechanical Engineering, University of Colorado at Boulder
- Gwangju Institute of Science and Technology
Research output: Contribution to journal › Article › peer-review
351
Scopus
citations