Resistance switching of the nonstoichiometric zirconium oxide for nonvolatile memory applications

  • Dongsoo Lee
  • , Hyejung Choi
  • , Hyunjun Sim
  • , Dooho Choi
  • , Hyunsang Hwang
  • , Myoung Jae Lee
  • , Sun Ae Seo
  • , I. K. Yoo

Research output: Contribution to journalArticlepeer-review

168 Scopus citations

Abstract

The resistance switching behavior and switching mechanism of nonstoichiometric zirconium oxide thin films were investigated for nonvolatile memory application. The Pt/ZrOx/p+-Si sandwich structure fabricated by reactive sputtering shows two stable resistance states. By applying proper bias, resistance switching from one to another state can be obtained. The composition in ZrOx thin films were confirmed from X-ray photoelectron spectroscope (XPS) analysis, which showed three layers such as top stoichiometric ZrO2 layer with high resistance, transition region with medium resistance, and conducting ZrOx bulk layer. The resistance switching can be explained by electron trapping and detrapping of excess Zr+ ions in transition layer which control the distribution of electric field inside the oxide, and, hence the current flow.

Original languageEnglish
Pages (from-to)719-721
Number of pages3
JournalIEEE Electron Device Letters
Volume26
Issue number10
DOIs
StatePublished - Oct 2005

Bibliographical note

Funding Information:
Manuscript received May 10, 2005; revised June 9, 2005. This work was supported in part by the Samsung Advanced Institute of Technology (SAIT) and in part by the Ministry of Science and Technology (MOST) under the National Research and Development Project. The review of this paper was arranged by Editor C.-P. Chang.

Keywords

  • Nonstoichiometric zirconium oxide
  • Resistance random access memory (RAM)
  • Resistive switching
  • Switching mechanism
  • Tri-layer structure
  • n-MOSFET

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