Preliminary study of the thermal impact of a microelectrode array implanted in the brain

Sohee Kim; Richard A. Normann; Reid Harrison; Florian Solzbacher

doi:10.1109/IEMBS.2006.260307

Preliminary study of the thermal impact of a microelectrode array implanted in the brain

Sohee Kim, Richard A. Normann, Reid Harrison, Florian Solzbacher

Department of Robotics and Mechatronics Engineering

University of Utah

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

41 Scopus citations

Abstract

One requirement of a chronically implantable, wireless neural interface device is the integration of electronic circuitry with the microelectrode array. Since the electronic IC dissipates a certain amount of power, it will affect the temperature in the tissues surrounding the implant site. In this paper, the thermal influence of an integrated, 3-dimensional Utah Electrode Array, to be implanted in the brain was investigated with simulations using the finite element method (FEM). A temperature increase in the brain tissue was predicted using preliminary simulations with simplified models. The model and method used in the simulations were verified by simple in vitro experiments.

Original language	English
Title of host publication	28th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS'06
Pages	2986-2989
Number of pages	4
DOIs	https://doi.org/10.1109/IEMBS.2006.260307
State	Published - 2006
Event	28th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS'06 - New York, NY, United States Duration: 30 Aug 2006 → 3 Sep 2006

Publication series

Name	Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings
ISSN (Print)	0589-1019

Conference

Conference	28th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS'06
Country/Territory	United States
City	New York, NY
Period	30/08/06 → 3/09/06

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10.1109/IEMBS.2006.260307

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Kim, S., Normann, R. A., Harrison, R., & Solzbacher, F. (2006). Preliminary study of the thermal impact of a microelectrode array implanted in the brain. In 28th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS'06 (pp. 2986-2989). Article 4030366 (Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings). https://doi.org/10.1109/IEMBS.2006.260307

@inproceedings{0c534aa26544460a901b969e5944a694,

title = "Preliminary study of the thermal impact of a microelectrode array implanted in the brain",

abstract = "One requirement of a chronically implantable, wireless neural interface device is the integration of electronic circuitry with the microelectrode array. Since the electronic IC dissipates a certain amount of power, it will affect the temperature in the tissues surrounding the implant site. In this paper, the thermal influence of an integrated, 3-dimensional Utah Electrode Array, to be implanted in the brain was investigated with simulations using the finite element method (FEM). A temperature increase in the brain tissue was predicted using preliminary simulations with simplified models. The model and method used in the simulations were verified by simple in vitro experiments.",

author = "Sohee Kim and Normann, {Richard A.} and Reid Harrison and Florian Solzbacher",

year = "2006",

doi = "10.1109/IEMBS.2006.260307",

language = "English",

isbn = "1424400325",

series = "Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings",

pages = "2986--2989",

booktitle = "28th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS'06",

note = "28th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS'06 ; Conference date: 30-08-2006 Through 03-09-2006",

}

Kim, S, Normann, RA, Harrison, R & Solzbacher, F 2006, Preliminary study of the thermal impact of a microelectrode array implanted in the brain. in 28th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS'06., 4030366, Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings, pp. 2986-2989, 28th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS'06, New York, NY, United States, 30/08/06. https://doi.org/10.1109/IEMBS.2006.260307

Preliminary study of the thermal impact of a microelectrode array implanted in the brain. / Kim, Sohee; Normann, Richard A.; Harrison, Reid et al.
28th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS'06. 2006. p. 2986-2989 4030366 (Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Preliminary study of the thermal impact of a microelectrode array implanted in the brain

AU - Kim, Sohee

AU - Normann, Richard A.

AU - Harrison, Reid

AU - Solzbacher, Florian

PY - 2006

Y1 - 2006

N2 - One requirement of a chronically implantable, wireless neural interface device is the integration of electronic circuitry with the microelectrode array. Since the electronic IC dissipates a certain amount of power, it will affect the temperature in the tissues surrounding the implant site. In this paper, the thermal influence of an integrated, 3-dimensional Utah Electrode Array, to be implanted in the brain was investigated with simulations using the finite element method (FEM). A temperature increase in the brain tissue was predicted using preliminary simulations with simplified models. The model and method used in the simulations were verified by simple in vitro experiments.

AB - One requirement of a chronically implantable, wireless neural interface device is the integration of electronic circuitry with the microelectrode array. Since the electronic IC dissipates a certain amount of power, it will affect the temperature in the tissues surrounding the implant site. In this paper, the thermal influence of an integrated, 3-dimensional Utah Electrode Array, to be implanted in the brain was investigated with simulations using the finite element method (FEM). A temperature increase in the brain tissue was predicted using preliminary simulations with simplified models. The model and method used in the simulations were verified by simple in vitro experiments.

UR - http://www.scopus.com/inward/record.url?scp=34047125467&partnerID=8YFLogxK

U2 - 10.1109/IEMBS.2006.260307

DO - 10.1109/IEMBS.2006.260307

M3 - Conference contribution

C2 - 17946999

AN - SCOPUS:34047125467

SN - 1424400325

SN - 9781424400324

T3 - Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings

SP - 2986

EP - 2989

BT - 28th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS'06

T2 - 28th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS'06

Y2 - 30 August 2006 through 3 September 2006

ER -

Kim S, Normann RA, Harrison R, Solzbacher F. Preliminary study of the thermal impact of a microelectrode array implanted in the brain. In 28th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS'06. 2006. p. 2986-2989. 4030366. (Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings). doi: 10.1109/IEMBS.2006.260307

Preliminary study of the thermal impact of a microelectrode array implanted in the brain

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