Pain Classification using Evoked EEG Induced by Thermal Grill Illusion - Deep Neural Network Approach

Jihoon Baek, Kyungho Won, Heegyu Kim, Sunghan Lee, Jinung An, Sung Chan Jun

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

As the quantification of pain has emerged in biomedical engineering today, studies have been developing biomarkers associated with pain actively by measuring bio-signals such as electroencephalogram (EEG). Recently, some EEG studies of cold and hot pain have been reported. However, they used one type of stimulus condition for each trial and a relatively long stimulation time to collect EEG features. In this study, EEG signals during Cool (20 °C), Warm (40 °C), and Thermal Grill Illusion (TGI, 20-40 °C) stimuli were collected from 43 subjects, and were classified by a deep convolutional neural network referred to as EEGNet. Three binary classifications for the three conditions (TGI, Cool, Warm) were conducted for each subject individually. Classification accuracies for TGI-Cool, TGI-Warm, and Warm-Cool were 0.74±0.01, 0.71±0.01, and 0.74±0.01, respectively. For subjects who rated the TGI significantly hotter than the Warm stimulus, the classification accuracy for TGI-Cool (0.74±0.01) was significantly higher than for TGI-Warm (0.71±0.01). In contrast, the classification accuracy for TGI-Cool (0.72±0.03) did not differ statistically from TGI-Warm (0.73±0.01) in subjects without illusion. We found that the TGI and Cool stimuli were classified better than the TGI and Warm stimuli, implying that objective EEG features are consistent with subjective behavioral results. Further, we observed that most discriminative features between the TGI and the Cool or Warm conditions appeared in the parietal area for subjects who perceived the illusion. We postulate that the somato-sensory cortex may be activated when TGI is perceived to be hot pain.

Original languageEnglish
Title of host publication2023 45th Annual International Conference of the IEEE Engineering in Medicine and Biology Conference, EMBC 2023 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350324471
DOIs
StatePublished - 2023
Event45th Annual International Conference of the IEEE Engineering in Medicine and Biology Conference, EMBC 2023 - Sydney, Australia
Duration: 24 Jul 202327 Jul 2023

Publication series

NameProceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS
ISSN (Print)1557-170X

Conference

Conference45th Annual International Conference of the IEEE Engineering in Medicine and Biology Conference, EMBC 2023
Country/TerritoryAustralia
CitySydney
Period24/07/2327/07/23

Bibliographical note

Publisher Copyright:
© 2023 IEEE.

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