TY - GEN
T1 - Packaging concepts for neuroprosthetic implants
AU - Töpper, M.
AU - Klein, M.
AU - Wilke, M.
AU - Oppermann, H.
AU - Kim, S.
AU - Tathireddy, P.
AU - Solzbacher, F.
AU - Reichl, H.
PY - 2007
Y1 - 2007
N2 - A wireless neuroprosthetic implant is under development to provide a device which is able to amplify, transmit, receive and apply data for max. hundred neurons. The brain interface consists of a 100 channel amplifier, data compression, RF communication, power recovery module, two 60-turn planar coils (Au on Polyimide) on a ferrite substrate, SMD components and a 10×10 Electrode Array. The Array is the Utah Array which is a Silicon based structure with tapered Si spikes which have a length of 1.8 mm. For the mentioned components biocompatible wafer level integration and interconnect technologies have been developed based on stacking the coil/ferrite combination of the amplifier IC which is itself flip chip bonded onto the array. The SMD components were reflow-soldered beside the stack as well as special designed ceramic spacer which ensured an electrical interconnection between coil and chip. The whole assembly will finally be coated by a Parylene layer to ensure the biocompatibiliy. Test assemblies and in-vivo experiments showed already the proof of concept. An additional capping technology is under development to ensure very high reliability.
AB - A wireless neuroprosthetic implant is under development to provide a device which is able to amplify, transmit, receive and apply data for max. hundred neurons. The brain interface consists of a 100 channel amplifier, data compression, RF communication, power recovery module, two 60-turn planar coils (Au on Polyimide) on a ferrite substrate, SMD components and a 10×10 Electrode Array. The Array is the Utah Array which is a Silicon based structure with tapered Si spikes which have a length of 1.8 mm. For the mentioned components biocompatible wafer level integration and interconnect technologies have been developed based on stacking the coil/ferrite combination of the amplifier IC which is itself flip chip bonded onto the array. The SMD components were reflow-soldered beside the stack as well as special designed ceramic spacer which ensured an electrical interconnection between coil and chip. The whole assembly will finally be coated by a Parylene layer to ensure the biocompatibiliy. Test assemblies and in-vivo experiments showed already the proof of concept. An additional capping technology is under development to ensure very high reliability.
UR - http://www.scopus.com/inward/record.url?scp=84875329121&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84875329121
SN - 9781622764662
T3 - 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007
SP - 677
EP - 680
BT - 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007
T2 - 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007
Y2 - 17 June 2007 through 20 June 2007
ER -