Nanoscale capacitors based on metal-insulator-carbon nanotube-metal (MICNM) structures

J. E. Jang, S. N. Cha, Y. Choi, D. J. Kang, D. G. Hasko, G. A.J. Amaratunga

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

We report on the electrical characteristics and the fabrication process of a nano-capacitor structure using metal-insulator-carbon nanotube-metal (MICNM) layers. The structure shows high capacitance and the possibility of ultra high integration density due to the unique nanotube structure. Nanoscale and high aspect ratio patterns are achieved by electron beam lithography for the fabrication of these vertical nanostructures, This structure can be applied to the substitution of capacitors employing the silicon pillar structure in dynamic random access memory (DRAM) or as a nanoscale capacitor for various nanoelectronic devices.

Original languageEnglish
Title of host publicationProceedings of ESSDERC 2005
Subtitle of host publication35th European Solid-State Device Research Conference
Pages545-547
Number of pages3
DOIs
StatePublished - 2005
EventESSDERC 2005: 35th European Solid-State Device Research Conference - Grenoble, France
Duration: 12 Sep 200516 Sep 2005

Publication series

NameProceedings of ESSDERC 2005: 35th European Solid-State Device Research Conference
Volume2005

Conference

ConferenceESSDERC 2005: 35th European Solid-State Device Research Conference
Country/TerritoryFrance
CityGrenoble
Period12/09/0516/09/05

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