Investigation of Cs surface layer formation in Cs-SIMS with TOF-MEIS and SIMS

  • L. Houssiau
  • , C. Noël
  • , N. Mine
  • , K. W. Jung
  • , W. J. Min
  • , D. W. Moon

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Abstract

In this report, cesiumsurface layers formed by Cs+ ion bombardment on silicon and phenylalanine (Phe) sampleswere analyzed by TOF-MEIS and ToF-SIMS. Si wafers were bombarded with 500 eV Cs+ ions, then were subsequently bombarded with five different Cs+ fluences corresponding to the transient and equilibrium regimes. The Phe layers were evaporated on Si wafers, up to 100 nm thickness. The samples were subsequently bombarded at four different fluences. For Phe, TOF-MEIS shows the formation of a sharp Cs surface layer of ∼0.5 nm thickness, on which the peak height increases with Cs+ ion bombardment and a long Cs tail builds up, penetrating deep into the subsurface. For Si, a similar Cs surface peak forms, but it saturates quickly compared to Phe.

Original languageEnglish
Pages (from-to)22-24
Number of pages3
JournalSurface and Interface Analysis
Volume46
Issue numberS1
DOIs
StatePublished - 1 Nov 2014

Bibliographical note

Publisher Copyright:
Copyright © 2014 John Wiley & Sons, Ltd.

Keywords

  • Cesium
  • Depth profiling
  • MEIS
  • Phenylalanine
  • SIMS
  • Silicon
  • TOF-MEIS
  • ToF-SIMS

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