Interfacial characteristics of HfO 2 films grown on strained Si 0.7Ge 0.3 by atomic-layer deposition

  • M. H. Cho
  • , H. S. Chang
  • , D. W. Moon
  • , S. K. Kang
  • , B. K. Min
  • , D. H. Ko
  • , H. S. Kim
  • , Paul C. McIntyre
  • , J. H. Lee
  • , J. H. Ku
  • , N. I. Lee

Research output: Contribution to journalArticlepeer-review

52 Scopus citations

Abstract

The effects of the interfacial characteristics of HfO 2 dielectrics on strained Si 0.7Ge 0.3 deposited by atomic layer deposition (ALD) were investigated. The silicate layer at the interfacial region was suppressed on SiGe substrate while the GeO x layer formed in the interfacial region was decreased after annealing treatment. The C-V characteristics of the 50-Ȧ-thick HfO 2 film was converted into polycrystalline structure after rapid annealing at 700°C. The results show that formation of GeO x decreased the accumulation capacitance and increased the oxide trap charge.

Original languageEnglish
Pages (from-to)1171-1173
Number of pages3
JournalApplied Physics Letters
Volume84
Issue number7
DOIs
StatePublished - 16 Feb 2004

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