Influence of system integration and packaging on its inductive power link for an integrated wireless neural interface

Sohee Kim; Reid R. Harrison; Florian Solzbacher

doi:10.1109/TBME.2009.2028614

Influence of system integration and packaging on its inductive power link for an integrated wireless neural interface

Sohee Kim, Reid R. Harrison, Florian Solzbacher

Department of Robotics and Mechatronics Engineering

University of Utah

Research output: Contribution to journal › Article › peer-review

9 Scopus citations

Abstract

In an integrated wireless neural interface based on the Utah electrode array, the implanted electronics are supplied with power through inductive coupling between two coils. This inductive link is affected by conductive and dielectric materials and media surrounding the implant coil. In this study, the influences of the integration of an implant coil on a silicon-based IC and electrode array, thin-film Parylene-C encapsulation, and physiological medium surrounding the coil were investigated systematically and quantitatively by empirical measurements. A few embodiments of implant coils with different geometrical parameters were made with a diameter of ∼ 5.5 mm by winding fine wire with a diameter of approximately 50 μm. The parasitic influences affecting the inductive link were empirically investigated by measuring the electrical properties of coils in different configurations and in different media. The distance of power transmission between the transmit and receive coils was measured when the receive coil was in air and immersed in phosphate buffered saline solution to simulate an implanted physiological environment. The results from this study quantitatively address the influences of factors such as device integration, encapsulation, and implantation on its inductive power link, and suggest how to maximize the efficiency in power transmission for such neural interface devices powered inductively.

Original language	English
Article number	5204201
Pages (from-to)	2927-2936
Number of pages	10
Journal	IEEE Transactions on Biomedical Engineering
Volume	56
Issue number	12
DOIs	https://doi.org/10.1109/TBME.2009.2028614
State	Published - Dec 2009

Bibliographical note

Funding Information:
Manuscript received August 6, 2008; revised March 11, 2009. First published August 18, 2009; current version published November 20, 2009. This work was supported in part by the National Institute of Health/National Institute of Neurological Disorders and Stroke, Neural Prosthesis Program under Contract HHSN265200423621C and in part by the Defense Advanced Research Projects Agency, Revolutionizing Prosthesis 2009 Program under Contract N66001-06-C-8005. Asterisk indicates corresponding author.

Keywords

Coil
Inductive coupling
Integration
Neural interface
Packaging
Quality factor
Resonance frequency
Utah electrode array (UEA)

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10.1109/TBME.2009.2028614

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@article{9cae902a8dcf4ee7bff7966219de2e74,

title = "Influence of system integration and packaging on its inductive power link for an integrated wireless neural interface",

abstract = "In an integrated wireless neural interface based on the Utah electrode array, the implanted electronics are supplied with power through inductive coupling between two coils. This inductive link is affected by conductive and dielectric materials and media surrounding the implant coil. In this study, the influences of the integration of an implant coil on a silicon-based IC and electrode array, thin-film Parylene-C encapsulation, and physiological medium surrounding the coil were investigated systematically and quantitatively by empirical measurements. A few embodiments of implant coils with different geometrical parameters were made with a diameter of ∼ 5.5 mm by winding fine wire with a diameter of approximately 50 μm. The parasitic influences affecting the inductive link were empirically investigated by measuring the electrical properties of coils in different configurations and in different media. The distance of power transmission between the transmit and receive coils was measured when the receive coil was in air and immersed in phosphate buffered saline solution to simulate an implanted physiological environment. The results from this study quantitatively address the influences of factors such as device integration, encapsulation, and implantation on its inductive power link, and suggest how to maximize the efficiency in power transmission for such neural interface devices powered inductively.",

keywords = "Coil, Inductive coupling, Integration, Neural interface, Packaging, Quality factor, Resonance frequency, Utah electrode array (UEA)",

author = "Sohee Kim and Harrison, {Reid R.} and Florian Solzbacher",

note = "Funding Information: Manuscript received August 6, 2008; revised March 11, 2009. First published August 18, 2009; current version published November 20, 2009. This work was supported in part by the National Institute of Health/National Institute of Neurological Disorders and Stroke, Neural Prosthesis Program under Contract HHSN265200423621C and in part by the Defense Advanced Research Projects Agency, Revolutionizing Prosthesis 2009 Program under Contract N66001-06-C-8005. Asterisk indicates corresponding author.",

year = "2009",

month = dec,

doi = "10.1109/TBME.2009.2028614",

language = "English",

volume = "56",

pages = "2927--2936",

journal = "IEEE Transactions on Biomedical Engineering",

issn = "0018-9294",

publisher = "IEEE Computer Society",

number = "12",

}

TY - JOUR

T1 - Influence of system integration and packaging on its inductive power link for an integrated wireless neural interface

AU - Kim, Sohee

AU - Harrison, Reid R.

AU - Solzbacher, Florian

N1 - Funding Information: Manuscript received August 6, 2008; revised March 11, 2009. First published August 18, 2009; current version published November 20, 2009. This work was supported in part by the National Institute of Health/National Institute of Neurological Disorders and Stroke, Neural Prosthesis Program under Contract HHSN265200423621C and in part by the Defense Advanced Research Projects Agency, Revolutionizing Prosthesis 2009 Program under Contract N66001-06-C-8005. Asterisk indicates corresponding author.

PY - 2009/12

Y1 - 2009/12

N2 - In an integrated wireless neural interface based on the Utah electrode array, the implanted electronics are supplied with power through inductive coupling between two coils. This inductive link is affected by conductive and dielectric materials and media surrounding the implant coil. In this study, the influences of the integration of an implant coil on a silicon-based IC and electrode array, thin-film Parylene-C encapsulation, and physiological medium surrounding the coil were investigated systematically and quantitatively by empirical measurements. A few embodiments of implant coils with different geometrical parameters were made with a diameter of ∼ 5.5 mm by winding fine wire with a diameter of approximately 50 μm. The parasitic influences affecting the inductive link were empirically investigated by measuring the electrical properties of coils in different configurations and in different media. The distance of power transmission between the transmit and receive coils was measured when the receive coil was in air and immersed in phosphate buffered saline solution to simulate an implanted physiological environment. The results from this study quantitatively address the influences of factors such as device integration, encapsulation, and implantation on its inductive power link, and suggest how to maximize the efficiency in power transmission for such neural interface devices powered inductively.

AB - In an integrated wireless neural interface based on the Utah electrode array, the implanted electronics are supplied with power through inductive coupling between two coils. This inductive link is affected by conductive and dielectric materials and media surrounding the implant coil. In this study, the influences of the integration of an implant coil on a silicon-based IC and electrode array, thin-film Parylene-C encapsulation, and physiological medium surrounding the coil were investigated systematically and quantitatively by empirical measurements. A few embodiments of implant coils with different geometrical parameters were made with a diameter of ∼ 5.5 mm by winding fine wire with a diameter of approximately 50 μm. The parasitic influences affecting the inductive link were empirically investigated by measuring the electrical properties of coils in different configurations and in different media. The distance of power transmission between the transmit and receive coils was measured when the receive coil was in air and immersed in phosphate buffered saline solution to simulate an implanted physiological environment. The results from this study quantitatively address the influences of factors such as device integration, encapsulation, and implantation on its inductive power link, and suggest how to maximize the efficiency in power transmission for such neural interface devices powered inductively.

KW - Coil

KW - Inductive coupling

KW - Integration

KW - Neural interface

KW - Packaging

KW - Quality factor

KW - Resonance frequency

KW - Utah electrode array (UEA)

UR - http://www.scopus.com/inward/record.url?scp=72649086850&partnerID=8YFLogxK

U2 - 10.1109/TBME.2009.2028614

DO - 10.1109/TBME.2009.2028614

M3 - Article

C2 - 19695994

AN - SCOPUS:72649086850

SN - 0018-9294

VL - 56

SP - 2927

EP - 2936

JO - IEEE Transactions on Biomedical Engineering

JF - IEEE Transactions on Biomedical Engineering

IS - 12

M1 - 5204201

ER -

Influence of system integration and packaging on its inductive power link for an integrated wireless neural interface

Abstract

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Keywords

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