In vitro and in vivo study of temperature increases in the brain due to a neural implant

Sohee Kim; Prashant Tathireddy; Richard A. Normann; Florian Solzbacher

doi:10.1109/CNE.2007.369637

In vitro and in vivo study of temperature increases in the brain due to a neural implant

Sohee Kim
, Prashant Tathireddy
, Richard A. Normann
, Florian Solzbacher

Department of Robotics and Mechatronics Engineering

University of Utah

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

22 Scopus citations

Abstract

A chronically implantable, wireless neural interface device requires integrating electronic circuitry with the interfacing microelectrodes in order to eliminate wired connections. Since the integrated circuit (IC) dissipates a certain amount of power, it will raise the temperature in surrounding tissues where it is implanted. In this paper, the thermal influence of the integrated 3-dimensional Utah Electrode Array (UEA) device implanted in the brain was investigated by experimental measurement in vitro as well as in vivo. The maximum temperature increase due to the integrated UEA system was measured to be 0.067°C/mW for in vitro and 0.050 °C/mW for in vivo conditions. Lower temperature increases of in vivo measurement are due to convection through the blood perfusion presenting in the living tissues.

Original language	English
Title of host publication	Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering
Pages	163-166
Number of pages	4
DOIs	https://doi.org/10.1109/CNE.2007.369637
State	Published - 2007
Event	3rd International IEEE EMBS Conference on Neural Engineering - Kohala Coast, HI, United States Duration: 2 May 2007 → 5 May 2007

Publication series

Name	Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering

Conference

Conference	3rd International IEEE EMBS Conference on Neural Engineering
Country/Territory	United States
City	Kohala Coast, HI
Period	2/05/07 → 5/05/07

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10.1109/CNE.2007.369637

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Kim, S., Tathireddy, P., Normann, R. A., & Solzbacher, F. (2007). In vitro and in vivo study of temperature increases in the brain due to a neural implant. In Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering (pp. 163-166). Article 4227242 (Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering). https://doi.org/10.1109/CNE.2007.369637

@inproceedings{3432d5eff7354f25995e65993ba5c18d,

title = "In vitro and in vivo study of temperature increases in the brain due to a neural implant",

abstract = "A chronically implantable, wireless neural interface device requires integrating electronic circuitry with the interfacing microelectrodes in order to eliminate wired connections. Since the integrated circuit (IC) dissipates a certain amount of power, it will raise the temperature in surrounding tissues where it is implanted. In this paper, the thermal influence of the integrated 3-dimensional Utah Electrode Array (UEA) device implanted in the brain was investigated by experimental measurement in vitro as well as in vivo. The maximum temperature increase due to the integrated UEA system was measured to be 0.067°C/mW for in vitro and 0.050 °C/mW for in vivo conditions. Lower temperature increases of in vivo measurement are due to convection through the blood perfusion presenting in the living tissues.",

author = "Sohee Kim and Prashant Tathireddy and Normann, \{Richard A.\} and Florian Solzbacher",

year = "2007",

doi = "10.1109/CNE.2007.369637",

language = "English",

isbn = "1424407923",

series = "Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering",

pages = "163--166",

booktitle = "Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering",

note = "3rd International IEEE EMBS Conference on Neural Engineering ; Conference date: 02-05-2007 Through 05-05-2007",

}

Kim, S, Tathireddy, P, Normann, RA & Solzbacher, F 2007, In vitro and in vivo study of temperature increases in the brain due to a neural implant. in Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering., 4227242, Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering, pp. 163-166, 3rd International IEEE EMBS Conference on Neural Engineering, Kohala Coast, HI, United States, 2/05/07. https://doi.org/10.1109/CNE.2007.369637

In vitro and in vivo study of temperature increases in the brain due to a neural implant. / Kim, Sohee; Tathireddy, Prashant; Normann, Richard A. et al.
Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering. 2007. p. 163-166 4227242 (Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - In vitro and in vivo study of temperature increases in the brain due to a neural implant

AU - Kim, Sohee

AU - Tathireddy, Prashant

AU - Normann, Richard A.

AU - Solzbacher, Florian

PY - 2007

Y1 - 2007

N2 - A chronically implantable, wireless neural interface device requires integrating electronic circuitry with the interfacing microelectrodes in order to eliminate wired connections. Since the integrated circuit (IC) dissipates a certain amount of power, it will raise the temperature in surrounding tissues where it is implanted. In this paper, the thermal influence of the integrated 3-dimensional Utah Electrode Array (UEA) device implanted in the brain was investigated by experimental measurement in vitro as well as in vivo. The maximum temperature increase due to the integrated UEA system was measured to be 0.067°C/mW for in vitro and 0.050 °C/mW for in vivo conditions. Lower temperature increases of in vivo measurement are due to convection through the blood perfusion presenting in the living tissues.

AB - A chronically implantable, wireless neural interface device requires integrating electronic circuitry with the interfacing microelectrodes in order to eliminate wired connections. Since the integrated circuit (IC) dissipates a certain amount of power, it will raise the temperature in surrounding tissues where it is implanted. In this paper, the thermal influence of the integrated 3-dimensional Utah Electrode Array (UEA) device implanted in the brain was investigated by experimental measurement in vitro as well as in vivo. The maximum temperature increase due to the integrated UEA system was measured to be 0.067°C/mW for in vitro and 0.050 °C/mW for in vivo conditions. Lower temperature increases of in vivo measurement are due to convection through the blood perfusion presenting in the living tissues.

UR - https://www.scopus.com/pages/publications/34548730239

U2 - 10.1109/CNE.2007.369637

DO - 10.1109/CNE.2007.369637

M3 - Conference contribution

AN - SCOPUS:34548730239

SN - 1424407923

SN - 9781424407927

T3 - Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering

SP - 163

EP - 166

BT - Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering

T2 - 3rd International IEEE EMBS Conference on Neural Engineering

Y2 - 2 May 2007 through 5 May 2007

ER -

In vitro and in vivo study of temperature increases in the brain due to a neural implant

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