Improvements of mechanical fatigue reliability of Cu interconnects on flexible substrates through MoTi alloy under-layer

Young Joo Lee; Hae A.Seul Shin; Dae Hyun Nam; Han Wool Yeon; Boae Nam; Kyoohee Woo; Young Chang Joo

doi:10.1007/s13391-014-4191-6

Improvements of mechanical fatigue reliability of Cu interconnects on flexible substrates through MoTi alloy under-layer

Young Joo Lee, Hae A.Seul Shin, Dae Hyun Nam, Han Wool Yeon, Boae Nam, Kyoohee Woo, Young Chang Joo

Department of Energy and Science and Engineering

Research output: Contribution to journal › Article › peer-review

9 Scopus citations

Abstract

The mechanical fatigue of Cu films and lines on flexible substrates was investigated, and an improvement in the structures through the use of a MoTi alloy under-layer was proposed. Fatigue reliability was decreased by 3-fold in lines compared with films in the tensile condition and by 6-fold in the compressive condition. Crack formation was observed to be more detrimental for lines than for films. With a MoTi under-layer, the fatigue limit was increased by 2 times that of a structure without MoTi in the tensile condition and by 15 times in the compressive bending condition. The suppression of delamination through the use of a MoTi under-layer improved the fatigue reliability under compressive bending.

Original language	English
Pages (from-to)	149-154
Number of pages	6
Journal	Electronic Materials Letters
Volume	11
Issue number	1
DOIs	https://doi.org/10.1007/s13391-014-4191-6
State	Published - 10 Jan 2015

Bibliographical note

Publisher Copyright:
© KIM and Springer.

Keywords

Cu interconnects
Fatigue
Flexible electronics
Mechanical reliability

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10.1007/s13391-014-4191-6

Cite this

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abstract = "The mechanical fatigue of Cu films and lines on flexible substrates was investigated, and an improvement in the structures through the use of a MoTi alloy under-layer was proposed. Fatigue reliability was decreased by 3-fold in lines compared with films in the tensile condition and by 6-fold in the compressive condition. Crack formation was observed to be more detrimental for lines than for films. With a MoTi under-layer, the fatigue limit was increased by 2 times that of a structure without MoTi in the tensile condition and by 15 times in the compressive bending condition. The suppression of delamination through the use of a MoTi under-layer improved the fatigue reliability under compressive bending.",

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AU - Lee, Young Joo

AU - Shin, Hae A.Seul

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AU - Yeon, Han Wool

AU - Nam, Boae

AU - Woo, Kyoohee

AU - Joo, Young Chang

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N2 - The mechanical fatigue of Cu films and lines on flexible substrates was investigated, and an improvement in the structures through the use of a MoTi alloy under-layer was proposed. Fatigue reliability was decreased by 3-fold in lines compared with films in the tensile condition and by 6-fold in the compressive condition. Crack formation was observed to be more detrimental for lines than for films. With a MoTi under-layer, the fatigue limit was increased by 2 times that of a structure without MoTi in the tensile condition and by 15 times in the compressive bending condition. The suppression of delamination through the use of a MoTi under-layer improved the fatigue reliability under compressive bending.

AB - The mechanical fatigue of Cu films and lines on flexible substrates was investigated, and an improvement in the structures through the use of a MoTi alloy under-layer was proposed. Fatigue reliability was decreased by 3-fold in lines compared with films in the tensile condition and by 6-fold in the compressive condition. Crack formation was observed to be more detrimental for lines than for films. With a MoTi under-layer, the fatigue limit was increased by 2 times that of a structure without MoTi in the tensile condition and by 15 times in the compressive bending condition. The suppression of delamination through the use of a MoTi under-layer improved the fatigue reliability under compressive bending.

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Improvements of mechanical fatigue reliability of Cu interconnects on flexible substrates through MoTi alloy under-layer

Abstract

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Keywords

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