Abstract
We report on a high-transparency low-resistance composite contact structure on p-GaN for light-emitting diode applications. The structure consists of a thin Ni (5 nm) Au (5 nm) layer overcoated with a sputtered Al-doped ZnO (170 nm) layer. Enhancement in light emission intensity as high as 74% at 40 mA and forward operating voltages in the range of 3.36-3.48 V at 20 mA are obtained for these devices using a two-step thermal annealing process.
| Original language | English |
|---|---|
| Article number | 181107 |
| Pages (from-to) | 1-3 |
| Number of pages | 3 |
| Journal | Applied Physics Letters |
| Volume | 87 |
| Issue number | 18 |
| DOIs | |
| State | Published - 31 Oct 2005 |