Abstract
To achieve high and uniform phosphorus (P) dopant concentration (more than 1×1020 cm-3) near the germanium (Ge) surface, H2 plasma treatment and modified plasma-assisted delta doping (MPADD) process are proposed and investigated. Sufficient vacancies are formed on the Ge surface using H2 plasma treatment. Consequently, P and vacancies are uniformly included inside during Ge growth through the MPADD process. After the annealing, phosphorus-vacancy-oxygen (PVO) clusters with the lowest binding energy are formed. Therefore, the migration activation energy increases, and the dopant diffusion into the substrate is reduced. As a result, the surface P dopant concentration (4×1021 cm-3) improves, and a uniform P concentration of approximately 5 nm is from the Ge surface. These results show that the MPADD process enables a uniform and high surface doping concentration of recently promising Ge materials and compensates for the disadvantages of conventional delta doping, such as long process time and the need for an ultra-high vacuum system.
Original language | English |
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Pages (from-to) | 1315-1318 |
Number of pages | 4 |
Journal | IEEE Electron Device Letters |
Volume | 43 |
Issue number | 8 |
DOIs | |
State | Published - 1 Aug 2022 |
Bibliographical note
Publisher Copyright:© 1980-2012 IEEE.
Keywords
- Hplasma treatment
- Modified plasma-assisted delta doping
- germanium
- phosphorus