Abstract
There is an exponentially growing need for well-oriented, vertical silicon nano/micro-structure arrays, particularly in high-density integrated electronic devices. Here, we demonstrate that precisely controlled vertical arrays of silicon wires and cones can be fabricated by a combined treatment strategy of electrochemical and chemical etchings. First, a periodically ordered array of silicon wires was readily fabricated at microscale by simple electrochemical etching in which the current density played a critical role in determining the wire diameter and interspacing. The microstructures fabricated by electrochemical etching were more precisely tuned by further chemical etching, thereby transforming into cone arrays with extremely sharp tips where the cone height was controlled by the etching time. This approach could have broad utility in many electronics requiring miniaturization and high-density integration such as field emitters, photovoltaic and thermoelectric devices.
| Original language | English |
|---|---|
| Pages (from-to) | 2567-2569 |
| Number of pages | 3 |
| Journal | Materials Letters |
| Volume | 63 |
| Issue number | 29 |
| DOIs | |
| State | Published - 15 Dec 2009 |
Bibliographical note
Funding Information:This work was supported by grants (nos. R01-2008-000-11488-0 and 2008-02964 ) from the Basic Research and Nano R&D Programs, respectively, of the National Research Foundation of Korea (NRF) funded by the Ministry of Education, Science and Technology. H.-S. Seo acknowledges financial support from the second-stage BK21 Project in 2007.
Keywords
- Cones
- Electrochemical etching
- Microstructure
- Surfaces
- Wires