Fabication of one-diode-one-resistor memory cell structure of Pt/CuO/Pt/TiN/Pt/CuO/InZnO x/Pt and the effect of TiN layer on the improved resistance switching characteristics

K. H. Kim, S. R. Lee, S. E. Ahn, M. J. Lee, B. S. Kang

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3 Scopus citations

Abstract

We investigated the electrical properties of oxide-based one diode/one resistor (1D-1R) memory cells for resistance switching memory device application employing NiO as a storage element and p-CuO/n-InZnO x diode as a steering element. The electrical property of the 1D-1R memory cells was significantly affected by the repetitive resistance switching operation of the NiO layer. It appears that oxygen vacancy movement from NiO layer leads to the degradation of the oxide diode. We introduced a conducting TiN layer as a diffusion barrier between the diode and the NiO. As a result, the reliability of the 1D-1R memory cells was significantly improved.

Original languageEnglish
Pages (from-to)2272-2277
Number of pages6
JournalThin Solid Films
Volume520
Issue number6
DOIs
StatePublished - 1 Jan 2012

Bibliographical note

Funding Information:
This work was supported by the research fund of Hanyang University (HY-2009-N). The authors acknowledge Dr. J. B. Park, Mr. C. B. Lee, Dr. D. S. Lee, Dr. Y.-B. Kim, and Dr. C. J. Kim for the helpful discussion.

Keywords

  • Diffusion
  • Nonvolatile memory
  • Oxygen vacancy
  • Resistance switching

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