TY - GEN
T1 - Excellent uniformity and reproducible resistance switching characteristics of doped binary metal oxides for non-volatile resistance memory applications
AU - Lee, Dongsoo
AU - Seong, Dong Jun
AU - Choi, Hye Jung
AU - Jo, Inhwa
AU - Dong, R.
AU - Xiang, W.
AU - Oh, Seokjoon
AU - Pyun, Myeongbum
AU - Seo, Sun Ok
AU - Heo, Seongho
AU - Jo, Minseok
AU - Hwang, Dae Kyu
AU - Park, H. K.
AU - Chang, M.
AU - Hasan, M.
AU - Hwang, Hyunsang
PY - 2006
Y1 - 2006
N2 - We have investigated various doped metal oxides such as copper doped molybdenum oxide, copper doped AI2.O3, copper doped ZrO2, aluminium doped ZnO, and CuxO for novel resistance memory applications. Compared with non-stoichiometric oxides (Nb 2O5-x, ZrOx, SrTiOx), doped metal oxides show higher device yield. Moreover, Cu: MoOx have demonstrated excellent memory characteristics such as reliability under programming cycles, potential multi-bit operation, good data retention, highly scalable property, and fast switching speed. The switching mechanism of the copper doped molybdenum oxide can be explained by the generation and rupture of multi-filaments under the electrical stress.
AB - We have investigated various doped metal oxides such as copper doped molybdenum oxide, copper doped AI2.O3, copper doped ZrO2, aluminium doped ZnO, and CuxO for novel resistance memory applications. Compared with non-stoichiometric oxides (Nb 2O5-x, ZrOx, SrTiOx), doped metal oxides show higher device yield. Moreover, Cu: MoOx have demonstrated excellent memory characteristics such as reliability under programming cycles, potential multi-bit operation, good data retention, highly scalable property, and fast switching speed. The switching mechanism of the copper doped molybdenum oxide can be explained by the generation and rupture of multi-filaments under the electrical stress.
UR - https://www.scopus.com/pages/publications/46049092606
U2 - 10.1109/IEDM.2006.346733
DO - 10.1109/IEDM.2006.346733
M3 - Conference contribution
AN - SCOPUS:46049092606
SN - 1424404398
SN - 9781424404391
T3 - Technical Digest - International Electron Devices Meeting, IEDM
BT - 2006 International Electron Devices Meeting Technical Digest, IEDM
T2 - 2006 International Electron Devices Meeting, IEDM
Y2 - 10 December 2006 through 13 December 2006
ER -