Elevating low-emissivity film for lower thermal transmittance

Rui Kou; Ying Zhong; Jeongmin Kim; Qingyang Wang; Meng Wang; Renkun Chen; Yu Qiao

doi:10.1016/j.enbuild.2019.03.033

Elevating low-emissivity film for lower thermal transmittance

Rui Kou, Ying Zhong, Jeongmin Kim, Qingyang Wang, Meng Wang, Renkun Chen, Yu Qiao

Division of Nanotechnology

University of California at San Diego

Research output: Contribution to journal › Article › peer-review

25 Scopus citations

Abstract

To minimize the heat loss through single-pane windows, we investigate the effects of elevating low-emissivity (low-e) film from glass pane. With an insulating air gap, not only heat conduction but also radiative thermal transfer can be suppressed. The thermal transmittance is reduced from 5~7 W/(m ² K) to less than 2.8 W/(m ² K). The water condensation resistance is enhanced. The visual transmittance and haze are satisfactory. The structural resilience of the hollow structure is excellent.

Original language	English
Pages (from-to)	69-77
Number of pages	9
Journal	Energy and Buildings
Volume	193
DOIs	https://doi.org/10.1016/j.enbuild.2019.03.033
State	Published - 15 Jun 2019

Bibliographical note

Publisher Copyright:
© 2019

Keywords

Low-emissivity film
Thermal insulation
Window energy

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10.1016/j.enbuild.2019.03.033

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@article{adf1389745c9400c84bc90bef3bb20db,

title = "Elevating low-emissivity film for lower thermal transmittance",

abstract = " To minimize the heat loss through single-pane windows, we investigate the effects of elevating low-emissivity (low-e) film from glass pane. With an insulating air gap, not only heat conduction but also radiative thermal transfer can be suppressed. The thermal transmittance is reduced from 5~7 W/(m 2 K) to less than 2.8 W/(m 2 K). The water condensation resistance is enhanced. The visual transmittance and haze are satisfactory. The structural resilience of the hollow structure is excellent.",

keywords = "Low-emissivity film, Thermal insulation, Window energy",

author = "Rui Kou and Ying Zhong and Jeongmin Kim and Qingyang Wang and Meng Wang and Renkun Chen and Yu Qiao",

note = "Publisher Copyright: {\textcopyright} 2019",

year = "2019",

month = jun,

day = "15",

doi = "10.1016/j.enbuild.2019.03.033",

language = "English",

volume = "193",

pages = "69--77",

journal = "Energy and Buildings",

issn = "0378-7788",

publisher = "Elsevier B.V.",

}

TY - JOUR

T1 - Elevating low-emissivity film for lower thermal transmittance

AU - Kou, Rui

AU - Zhong, Ying

AU - Kim, Jeongmin

AU - Wang, Qingyang

AU - Wang, Meng

AU - Chen, Renkun

AU - Qiao, Yu

PY - 2019/6/15

Y1 - 2019/6/15

N2 - To minimize the heat loss through single-pane windows, we investigate the effects of elevating low-emissivity (low-e) film from glass pane. With an insulating air gap, not only heat conduction but also radiative thermal transfer can be suppressed. The thermal transmittance is reduced from 5~7 W/(m 2 K) to less than 2.8 W/(m 2 K). The water condensation resistance is enhanced. The visual transmittance and haze are satisfactory. The structural resilience of the hollow structure is excellent.

AB - To minimize the heat loss through single-pane windows, we investigate the effects of elevating low-emissivity (low-e) film from glass pane. With an insulating air gap, not only heat conduction but also radiative thermal transfer can be suppressed. The thermal transmittance is reduced from 5~7 W/(m 2 K) to less than 2.8 W/(m 2 K). The water condensation resistance is enhanced. The visual transmittance and haze are satisfactory. The structural resilience of the hollow structure is excellent.

KW - Low-emissivity film

KW - Thermal insulation

KW - Window energy

UR - http://www.scopus.com/inward/record.url?scp=85063376458&partnerID=8YFLogxK

U2 - 10.1016/j.enbuild.2019.03.033

DO - 10.1016/j.enbuild.2019.03.033

M3 - Article

AN - SCOPUS:85063376458

SN - 0378-7788

VL - 193

SP - 69

EP - 77

JO - Energy and Buildings

JF - Energy and Buildings

ER -

Elevating low-emissivity film for lower thermal transmittance

Abstract

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Keywords

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