TY - GEN
T1 - Electromagnetic compatibility of two novel packaging concepts of an inductively powered neural interface
AU - Kim, Sohee
AU - Wilke, Martin
AU - Klein, Matthias
AU - Toepper, Michael
AU - Solzbacher, Florian
PY - 2007
Y1 - 2007
N2 - For implantable neuroprosthetic devices, reliable packaging of the device is one of the requirements. Selection of proper packaging material and design is essential to protect the device from moist fluidic environment in the body as well as not to cause any harm to the implanted tissue. In particular, packaging needs to be designed carefully when the device operates wirelessly through inductive coupling between two coils, since the packaging could degrade the power transmission due to the losses in the packaging itself. In this study, the influence of the proposed packaging methods on the magnetic power transmission was investigated using numerical simulations with the help of finite element analysis. The simulation showed that both proposed packaging concepts of using a silicon lid and LTCC ferrite lid do not degrade the power transmission significantly at the selected frequency of 2.64 MHz.
AB - For implantable neuroprosthetic devices, reliable packaging of the device is one of the requirements. Selection of proper packaging material and design is essential to protect the device from moist fluidic environment in the body as well as not to cause any harm to the implanted tissue. In particular, packaging needs to be designed carefully when the device operates wirelessly through inductive coupling between two coils, since the packaging could degrade the power transmission due to the losses in the packaging itself. In this study, the influence of the proposed packaging methods on the magnetic power transmission was investigated using numerical simulations with the help of finite element analysis. The simulation showed that both proposed packaging concepts of using a silicon lid and LTCC ferrite lid do not degrade the power transmission significantly at the selected frequency of 2.64 MHz.
UR - https://www.scopus.com/pages/publications/34548747463
U2 - 10.1109/CNE.2007.369702
DO - 10.1109/CNE.2007.369702
M3 - Conference contribution
AN - SCOPUS:34548747463
SN - 1424407923
SN - 9781424407927
T3 - Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering
SP - 434
EP - 437
BT - Proceedings of the 3rd International IEEE EMBS Conference on Neural Engineering
T2 - 3rd International IEEE EMBS Conference on Neural Engineering
Y2 - 2 May 2007 through 5 May 2007
ER -