Abstract
We analyzed the effects of Cu source/drain (S/D) electrodes on the performance of a-InGaZnO (a-IGZO) thin-film transistors (TFTs). Owing to the Cu migration, the parasitic resistance was as low as 10 cm with small current transfer length. Based on the transfer characteristics, we found that V DS dependent Cu migration creates donor-like deep and tail states in the sub-bandgap region. The feasibility of Cu S/D electrodes for a-IGZO TFTs using inverter circuits indicates that fabrication of high performance circuits is possible by controlling the Cu electro-migration.
Original language | English |
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Article number | 112109 |
Journal | Applied Physics Letters |
Volume | 100 |
Issue number | 11 |
DOIs | |
State | Published - 12 Mar 2012 |
Bibliographical note
Funding Information:This work was supported by the basic research program (12-NB-02) of the Daegu Gyeongbuk Institute of Science and Technology (DGIST) in Korea.