TY - GEN
T1 - Effect of oxygen migration and interface engineering on resistance switching behavior of reactive metal/polycrystalline Pr0.7Ca 0.3MnO3 device for nonvolatile memory applications
AU - Seong, Dong Jun
AU - Park, Jubong
AU - Lee, Nodo
AU - Hasan, Musarrat
AU - Jung, Seungjae
AU - Choi, Hyejung
AU - Lee, Joonmyoung
AU - Jo, Minseok
AU - Lee, Wootae
AU - Park, Sangsu
AU - Kim, Seonghyun
AU - Jang, Yun Hee
AU - Lee, Y.
AU - Sung, M.
AU - Kil, D.
AU - Hwang, Y.
AU - Chung, S.
AU - Hong, S.
AU - Roh, J.
AU - Hwang, Hyunsang
PY - 2009
Y1 - 2009
N2 - An in-depth study on the resistive switching mechanism of perovskite oxide based device was performed. Compared with filament type resistive switching device, excellent switching uniformity was obtained due to controlled redox reaction at metal/oxide interface. Electromigration of oxygen ion under the bipolar electric filed can explain the switching behavior. Formation of ultrathin AlOx at the interface can guarantee excellent retention characteristics at 125 °C Compared with the large area (50 × 50 um2) memory cell, the nanoscale device (φ=50 nm) showed better memory performance such as faster switching speed, better uniformity, endurance, and retention characteristics.
AB - An in-depth study on the resistive switching mechanism of perovskite oxide based device was performed. Compared with filament type resistive switching device, excellent switching uniformity was obtained due to controlled redox reaction at metal/oxide interface. Electromigration of oxygen ion under the bipolar electric filed can explain the switching behavior. Formation of ultrathin AlOx at the interface can guarantee excellent retention characteristics at 125 °C Compared with the large area (50 × 50 um2) memory cell, the nanoscale device (φ=50 nm) showed better memory performance such as faster switching speed, better uniformity, endurance, and retention characteristics.
UR - https://www.scopus.com/pages/publications/77952357834
U2 - 10.1109/IEDM.2009.5424410
DO - 10.1109/IEDM.2009.5424410
M3 - Conference contribution
AN - SCOPUS:77952357834
SN - 9781424456406
T3 - Technical Digest - International Electron Devices Meeting, IEDM
SP - 5.4.1-5.4.4
BT - 2009 International Electron Devices Meeting, IEDM 2009 - Technical Digest
T2 - 2009 International Electron Devices Meeting, IEDM 2009
Y2 - 7 December 2009 through 9 December 2009
ER -