Abstract
We report on the effect of Ni and NiO interlayers on an indium oxide-doped ZnO (IZO)-based ohmic scheme for a transparent and low resistance contact to the p-GaN. Ni/IZO and NiO/IZO contact layers on p-GaN yielded very low specific contact resistances of 9.2 × 10-5 and 3.6 × 10 -5 Ω cm2, respectively, after annealing at 500°C for 1 min under a nitrogen ambient. Auger electron spectroscopy and X-ray photoemission spectroscopy analysis of the IZO and p-GaN interface indicated that Ga atoms out-diffused and the NiO phase was formed at the interface region after the thermal annealing process, resulting in a decrease in contact resistance.
Original language | English |
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Pages (from-to) | G491-G493 |
Journal | Journal of the Electrochemical Society |
Volume | 152 |
Issue number | 6 |
DOIs | |
State | Published - 2005 |