Die level release of silicon photonic MEMS

Jonas Jacobs; Teodoro Graziosi; Marcell Kiss; Sangyoon Han; Tae Joon Seok; Ming C. Wu; Niels Quack

doi:10.1109/OMN.2016.7565832

Die level release of silicon photonic MEMS

Jonas Jacobs, Teodoro Graziosi, Marcell Kiss, Sangyoon Han, Tae Joon Seok, Ming C. Wu, Niels Quack

Department of Robotics and Mechatronics Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

6 Scopus citations

Abstract

We demonstrate a die level release process for silicon photonic MEMS structures, that is compatible with dies from a standard silicon photonics foundry process which are only several square millimeters in size.

Original language	English
Title of host publication	2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings
Publisher	IEEE Computer Society
ISBN (Electronic)	9781509010356
DOIs	https://doi.org/10.1109/OMN.2016.7565832
State	Published - 13 Sep 2016
Event	21st International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Singapore, Singapore Duration: 31 Jul 2016 → 4 Aug 2016

Publication series

Name	International Conference on Optical MEMS and Nanophotonics
Volume	2016-September
ISSN (Print)	2160-5033
ISSN (Electronic)	2160-5041

Conference

Conference	21st International Conference on Optical MEMS and Nanophotonics, OMN 2016
Country/Territory	Singapore
City	Singapore
Period	31/07/16 → 4/08/16

Bibliographical note

Publisher Copyright:
© 2016 IEEE.

Keywords

ALD
HF Vapor
MPW
Release
Silicon Photonic MEMS

Access to Document

10.1109/OMN.2016.7565832

Cite this

Jacobs, J., Graziosi, T., Kiss, M., Han, S., Seok, T. J., Wu, M. C., & Quack, N. (2016). Die level release of silicon photonic MEMS. In 2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings Article 7565832 (International Conference on Optical MEMS and Nanophotonics; Vol. 2016-September). IEEE Computer Society. https://doi.org/10.1109/OMN.2016.7565832

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title = "Die level release of silicon photonic MEMS",

abstract = "We demonstrate a die level release process for silicon photonic MEMS structures, that is compatible with dies from a standard silicon photonics foundry process which are only several square millimeters in size.",

keywords = "ALD, HF Vapor, MPW, Release, Silicon Photonic MEMS",

author = "Jonas Jacobs and Teodoro Graziosi and Marcell Kiss and Sangyoon Han and Seok, \{Tae Joon\} and Wu, \{Ming C.\} and Niels Quack",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 21st International Conference on Optical MEMS and Nanophotonics, OMN 2016 ; Conference date: 31-07-2016 Through 04-08-2016",

year = "2016",

month = sep,

day = "13",

doi = "10.1109/OMN.2016.7565832",

language = "English",

series = "International Conference on Optical MEMS and Nanophotonics",

publisher = "IEEE Computer Society",

booktitle = "2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings",

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Jacobs, J, Graziosi, T, Kiss, M, Han, S, Seok, TJ, Wu, MC & Quack, N 2016, Die level release of silicon photonic MEMS. in 2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings., 7565832, International Conference on Optical MEMS and Nanophotonics, vol. 2016-September, IEEE Computer Society, 21st International Conference on Optical MEMS and Nanophotonics, OMN 2016, Singapore, Singapore, 31/07/16. https://doi.org/10.1109/OMN.2016.7565832

Die level release of silicon photonic MEMS. / Jacobs, Jonas; Graziosi, Teodoro; Kiss, Marcell et al.
2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings. IEEE Computer Society, 2016. 7565832 (International Conference on Optical MEMS and Nanophotonics; Vol. 2016-September).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Die level release of silicon photonic MEMS

AU - Jacobs, Jonas

AU - Graziosi, Teodoro

AU - Kiss, Marcell

AU - Han, Sangyoon

AU - Seok, Tae Joon

AU - Wu, Ming C.

AU - Quack, Niels

PY - 2016/9/13

Y1 - 2016/9/13

N2 - We demonstrate a die level release process for silicon photonic MEMS structures, that is compatible with dies from a standard silicon photonics foundry process which are only several square millimeters in size.

AB - We demonstrate a die level release process for silicon photonic MEMS structures, that is compatible with dies from a standard silicon photonics foundry process which are only several square millimeters in size.

KW - ALD

KW - HF Vapor

KW - MPW

KW - Release

KW - Silicon Photonic MEMS

UR - https://www.scopus.com/pages/publications/84990252247

U2 - 10.1109/OMN.2016.7565832

DO - 10.1109/OMN.2016.7565832

M3 - Conference contribution

AN - SCOPUS:84990252247

T3 - International Conference on Optical MEMS and Nanophotonics

BT - 2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings

PB - IEEE Computer Society

T2 - 21st International Conference on Optical MEMS and Nanophotonics, OMN 2016

Y2 - 31 July 2016 through 4 August 2016

ER -

Die level release of silicon photonic MEMS

Abstract

Publication series

Conference

Bibliographical note

Keywords

Access to Document

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