Abstract
Resistance change random access memory devices using Ni Ox films with resistance switching properties have immense potential for high-density nonvolatile memory exceeding currently used flash memory. The only critical failure of a Ni Ox film is to write wrong information due to large fluctuations of switching voltages during successive resistance switching operations. The authors show that failure-free Ni Ox film can be grown directly on Pt electrode just by process control. Intensive analyses show that the superior resistance switching behaviors of their simple PtNi Ox Pt structure may result from a very thin Ni-Pt layer self-formed at the bottom interface during deposition of Ni Ox.
Original language | English |
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Article number | 022112 |
Journal | Applied Physics Letters |
Volume | 91 |
Issue number | 2 |
DOIs | |
State | Published - 2007 |
Bibliographical note
Funding Information:One of the authors (B.H.P.) was supported by Konkuk University in 2003.