TY - GEN
T1 - Computational study on thermal effects of coil-based implantable magnetic stimulation using finite element analysis
AU - Park, Heejin
AU - Kim, Sohee
PY - 2013
Y1 - 2013
N2 - Although electrical stimulation has been widely used as a means of treating neurological deficits, it has several limitations as implantable devices. In electrical stimulation, electrodes have shown degraded electrical performance over time due to glial scar encapsulation. And, under certain circumstances such as magnetic resonance imaging examination, deep brain stimulator can damage the brain tissue by electrode heating. To overcome such limitations, micro magnetic stimulation was suggested as a novel method. One of the strong points of this method is that no direct contact is required between the target tissue and electrode, because induced currents are used for neural stimulation. In this paper, the maximum temperature rise was estimated depending on the stimulation waveforms applied to the coil using FEA simulation.
AB - Although electrical stimulation has been widely used as a means of treating neurological deficits, it has several limitations as implantable devices. In electrical stimulation, electrodes have shown degraded electrical performance over time due to glial scar encapsulation. And, under certain circumstances such as magnetic resonance imaging examination, deep brain stimulator can damage the brain tissue by electrode heating. To overcome such limitations, micro magnetic stimulation was suggested as a novel method. One of the strong points of this method is that no direct contact is required between the target tissue and electrode, because induced currents are used for neural stimulation. In this paper, the maximum temperature rise was estimated depending on the stimulation waveforms applied to the coil using FEA simulation.
UR - https://www.scopus.com/pages/publications/84897711672
U2 - 10.1109/NER.2013.6696229
DO - 10.1109/NER.2013.6696229
M3 - Conference contribution
AN - SCOPUS:84897711672
SN - 9781467319690
T3 - International IEEE/EMBS Conference on Neural Engineering, NER
SP - 1497
EP - 1500
BT - 2013 6th International IEEE EMBS Conference on Neural Engineering, NER 2013
T2 - 2013 6th International IEEE EMBS Conference on Neural Engineering, NER 2013
Y2 - 6 November 2013 through 8 November 2013
ER -