Biocompatible hybrid flip chip microsystem integration for next generation wireless neural interfaces

M. Töpper; M. Klein; K. Buschick; V. Glaw; K. Orth; O. Ehrmann; M. Hutter; H. Oppermann; K. F. Becker; T. Braun; F. Ebling; H. Reichl; S. Kim; P. Tathireddy; S. Chakravarty; F. Solzbacher

doi:10.1109/ECTC.2006.1645734

Biocompatible hybrid flip chip microsystem integration for next generation wireless neural interfaces

M. Töpper
, M. Klein
, K. Buschick
, V. Glaw
, K. Orth
, O. Ehrmann
, M. Hutter
, H. Oppermann
, K. F. Becker
, T. Braun
, F. Ebling
, H. Reichl
, S. Kim
, P. Tathireddy
, S. Chakravarty
, F. Solzbacher

Department of Robotics and Mechatronics Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

24 Scopus citations

Abstract

Chronically implantable, wireless neural interfaces require biocompatible, long term stable, and high density integration of all functional sub-components. For this, the integration and interconnection concept of the wireless neural interface was proposed and interconnection materials and methods were investigated and characterized. The module consists of an electronics IC assembled to an electrode array. Thin film flex coils are glued onto the back side of the IC. The IC was interconnected by AuSn reflow flip chip bonding on the backside of the Utah Electrode Array (UEA) and off-chip electric components were SnCu0.7 soldered on the integrated IC/UEA module to guarantee a reliable connectivity.

Original language	English
Title of host publication	Proceedings - IEEE 56th Electronic Components and Technology Conference
Pages	705-708
Number of pages	4
DOIs	https://doi.org/10.1109/ECTC.2006.1645734
State	Published - 2006
Event	IEEE 56th Electronic Components and Technology Conference - San Diego, CA, United States Duration: 30 May 2006 → 2 Jun 2006

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	2006
ISSN (Print)	0569-5503

Conference

Conference	IEEE 56th Electronic Components and Technology Conference
Country/Territory	United States
City	San Diego, CA
Period	30/05/06 → 2/06/06

Access to Document

10.1109/ECTC.2006.1645734

Cite this

Töpper, M., Klein, M., Buschick, K., Glaw, V., Orth, K., Ehrmann, O., Hutter, M., Oppermann, H., Becker, K. F., Braun, T., Ebling, F., Reichl, H., Kim, S., Tathireddy, P., Chakravarty, S., & Solzbacher, F. (2006). Biocompatible hybrid flip chip microsystem integration for next generation wireless neural interfaces. In Proceedings - IEEE 56th Electronic Components and Technology Conference (pp. 705-708). Article 1645734 (Proceedings - Electronic Components and Technology Conference; Vol. 2006). https://doi.org/10.1109/ECTC.2006.1645734

@inproceedings{99702321f0334a3fb521aeef76dc65f2,

title = "Biocompatible hybrid flip chip microsystem integration for next generation wireless neural interfaces",

abstract = "Chronically implantable, wireless neural interfaces require biocompatible, long term stable, and high density integration of all functional sub-components. For this, the integration and interconnection concept of the wireless neural interface was proposed and interconnection materials and methods were investigated and characterized. The module consists of an electronics IC assembled to an electrode array. Thin film flex coils are glued onto the back side of the IC. The IC was interconnected by AuSn reflow flip chip bonding on the backside of the Utah Electrode Array (UEA) and off-chip electric components were SnCu0.7 soldered on the integrated IC/UEA module to guarantee a reliable connectivity.",

author = "M. T{\"o}pper and M. Klein and K. Buschick and V. Glaw and K. Orth and O. Ehrmann and M. Hutter and H. Oppermann and Becker, \{K. F.\} and T. Braun and F. Ebling and H. Reichl and S. Kim and P. Tathireddy and S. Chakravarty and F. Solzbacher",

year = "2006",

doi = "10.1109/ECTC.2006.1645734",

language = "English",

isbn = "1424401526",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "705--708",

booktitle = "Proceedings - IEEE 56th Electronic Components and Technology Conference",

note = "IEEE 56th Electronic Components and Technology Conference ; Conference date: 30-05-2006 Through 02-06-2006",

}

Töpper, M, Klein, M, Buschick, K, Glaw, V, Orth, K, Ehrmann, O, Hutter, M, Oppermann, H, Becker, KF, Braun, T, Ebling, F, Reichl, H, Kim, S, Tathireddy, P, Chakravarty, S & Solzbacher, F 2006, Biocompatible hybrid flip chip microsystem integration for next generation wireless neural interfaces. in Proceedings - IEEE 56th Electronic Components and Technology Conference., 1645734, Proceedings - Electronic Components and Technology Conference, vol. 2006, pp. 705-708, IEEE 56th Electronic Components and Technology Conference, San Diego, CA, United States, 30/05/06. https://doi.org/10.1109/ECTC.2006.1645734

Biocompatible hybrid flip chip microsystem integration for next generation wireless neural interfaces. / Töpper, M.; Klein, M.; Buschick, K. et al.
Proceedings - IEEE 56th Electronic Components and Technology Conference. 2006. p. 705-708 1645734 (Proceedings - Electronic Components and Technology Conference; Vol. 2006).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Orth, K.

AU - Ehrmann, O.

AU - Hutter, M.

AU - Oppermann, H.

AU - Becker, K. F.

AU - Braun, T.

AU - Ebling, F.

AU - Reichl, H.

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AB - Chronically implantable, wireless neural interfaces require biocompatible, long term stable, and high density integration of all functional sub-components. For this, the integration and interconnection concept of the wireless neural interface was proposed and interconnection materials and methods were investigated and characterized. The module consists of an electronics IC assembled to an electrode array. Thin film flex coils are glued onto the back side of the IC. The IC was interconnected by AuSn reflow flip chip bonding on the backside of the Utah Electrode Array (UEA) and off-chip electric components were SnCu0.7 soldered on the integrated IC/UEA module to guarantee a reliable connectivity.

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M3 - Conference contribution

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BT - Proceedings - IEEE 56th Electronic Components and Technology Conference

T2 - IEEE 56th Electronic Components and Technology Conference

Y2 - 30 May 2006 through 2 June 2006

ER -

Biocompatible hybrid flip chip microsystem integration for next generation wireless neural interfaces

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