Au-Based Biocompatible Capacitive Strain Sensor

Mugeun Lee; Hwajoong Kim; Jinho Kim; Minji Jeong; Jaehong Lee

doi:10.1109/FLEPS57599.2023.10220408

Au-Based Biocompatible Capacitive Strain Sensor

Mugeun Lee, Hwajoong Kim, Jinho Kim, Minji Jeong, Jaehong Lee

Department of Robotics and Mechatronics Engineering

Daegu Gyeongbuk Institute of Science and Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

Various strain sensors have been developed due to their capability to monitor a piece of basic physiological information. However, a lot of existing strain sensor is based on planar soft sensors, which have a few critical challenges such as structural mismatch and stable fixation on the target organ. Here, we present a 1-dimensional and biocompatible capacitive fiber strain sensor. The fiber strain sensor comprises a conductive fiber electrode based on Au, a representative biocompatible material. The structure of the fiber strain sensor is a double helix. The sensor shows high sensitivity of 9.8 and high stability.

Original language	English
Title of host publication	FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781665457330
DOIs	https://doi.org/10.1109/FLEPS57599.2023.10220408
State	Published - 2023
Event	5th IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023 - Boston, United States Duration: 9 Jul 2023 → 12 Jul 2023

Publication series

Name	FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings

Conference

Conference	5th IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023
Country/Territory	United States
City	Boston
Period	9/07/23 → 12/07/23

Bibliographical note

Publisher Copyright:
© 2023 IEEE.

Keywords

Biocompatibility
Capacitive type
Strain sensor

Access to Document

10.1109/FLEPS57599.2023.10220408

Cite this

Lee, M., Kim, H., Kim, J., Jeong, M., & Lee, J. (2023). Au-Based Biocompatible Capacitive Strain Sensor. In FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings (FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/FLEPS57599.2023.10220408

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abstract = "Various strain sensors have been developed due to their capability to monitor a piece of basic physiological information. However, a lot of existing strain sensor is based on planar soft sensors, which have a few critical challenges such as structural mismatch and stable fixation on the target organ. Here, we present a 1-dimensional and biocompatible capacitive fiber strain sensor. The fiber strain sensor comprises a conductive fiber electrode based on Au, a representative biocompatible material. The structure of the fiber strain sensor is a double helix. The sensor shows high sensitivity of 9.8 and high stability.",

keywords = "Biocompatibility, Capacitive type, Strain sensor",

author = "Mugeun Lee and Hwajoong Kim and Jinho Kim and Minji Jeong and Jaehong Lee",

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year = "2023",

doi = "10.1109/FLEPS57599.2023.10220408",

language = "English",

series = "FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings",

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Lee, M, Kim, H, Kim, J, Jeong, M & Lee, J 2023, Au-Based Biocompatible Capacitive Strain Sensor. in FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings. FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings, Institute of Electrical and Electronics Engineers Inc., 5th IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023, Boston, United States, 9/07/23. https://doi.org/10.1109/FLEPS57599.2023.10220408

Au-Based Biocompatible Capacitive Strain Sensor. / Lee, Mugeun; Kim, Hwajoong; Kim, Jinho et al.
FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings. Institute of Electrical and Electronics Engineers Inc., 2023. (FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Kim, Hwajoong

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AU - Jeong, Minji

AU - Lee, Jaehong

PY - 2023

Y1 - 2023

N2 - Various strain sensors have been developed due to their capability to monitor a piece of basic physiological information. However, a lot of existing strain sensor is based on planar soft sensors, which have a few critical challenges such as structural mismatch and stable fixation on the target organ. Here, we present a 1-dimensional and biocompatible capacitive fiber strain sensor. The fiber strain sensor comprises a conductive fiber electrode based on Au, a representative biocompatible material. The structure of the fiber strain sensor is a double helix. The sensor shows high sensitivity of 9.8 and high stability.

AB - Various strain sensors have been developed due to their capability to monitor a piece of basic physiological information. However, a lot of existing strain sensor is based on planar soft sensors, which have a few critical challenges such as structural mismatch and stable fixation on the target organ. Here, we present a 1-dimensional and biocompatible capacitive fiber strain sensor. The fiber strain sensor comprises a conductive fiber electrode based on Au, a representative biocompatible material. The structure of the fiber strain sensor is a double helix. The sensor shows high sensitivity of 9.8 and high stability.

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KW - Capacitive type

KW - Strain sensor

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DO - 10.1109/FLEPS57599.2023.10220408

M3 - Conference contribution

AN - SCOPUS:85171548903

T3 - FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings

BT - FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 5th IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023

Y2 - 9 July 2023 through 12 July 2023

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Lee M, Kim H, Kim J, Jeong M, Lee J. Au-Based Biocompatible Capacitive Strain Sensor. In FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings. Institute of Electrical and Electronics Engineers Inc. 2023. (FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings). doi: 10.1109/FLEPS57599.2023.10220408

Au-Based Biocompatible Capacitive Strain Sensor

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Keywords

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