Advanced 2D die placement inspection system for reliable flip chip interconnections based on 3D information of die and substrate by a phase measuring profilometry

Hyun Kee Lee, Min Young Kim

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Fingerprint

Dive into the research topics of 'Advanced 2D die placement inspection system for reliable flip chip interconnections based on 3D information of die and substrate by a phase measuring profilometry'. Together they form a unique fingerprint.

Computer Science