Abstract
Micromagnetic stimulation using small-sized implantable coils has recently been studied. The main advantage of this method is that it can provide sustainable stimulation performance even if a fibrotic encapsulation layer is formed around the implanted coil by inflammation response, because indirectly induced currents are used to induce neural responses. In previous research, we optimized the geometrical and control parameters used in implantable magnetic stimulation. Based on those results, we fabricated the planar coil and studied the LTP effect in the hippocampal slice by two different magnetic stimulation protocols using the quadripulse stimulation (QPS) pattern. We found that direct magnetic stimulation (DMS) induced insignificant LTP effect and priming magnetic stimulation (PMS) occluded LTP effect after tetanic stimulation, when QPS patterned magnetic stimulation with 1 A current pulse was applied to the planar coil.
| Original language | English |
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| Title of host publication | 2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society |
| Subtitle of host publication | Smarter Technology for a Healthier World, EMBC 2017 - Proceedings |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 1118-1121 |
| Number of pages | 4 |
| ISBN (Electronic) | 9781509028092 |
| DOIs | |
| State | Published - 13 Sep 2017 |
| Event | 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2017 - Jeju Island, Korea, Republic of Duration: 11 Jul 2017 → 15 Jul 2017 |
Publication series
| Name | Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS |
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| ISSN (Print) | 1557-170X |
Conference
| Conference | 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2017 |
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| Country/Territory | Korea, Republic of |
| City | Jeju Island |
| Period | 11/07/17 → 15/07/17 |
Bibliographical note
Publisher Copyright:© 2017 IEEE.