A 20Gb/s transceiver with framed-pulsewidth modulation in 40nm CMOS

Sejun Jeon, Woohyun Kwon, Taehun Yoon, Jong Hyeok Yoon, Kyeongha Kwon, Jaehyeok Yang, Hyeon Min Bae

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

7 Scopus citations

Abstract

Expanding signal bandwidths in high-speed links is increasing intersymbol interference (ISI), which necessitates the enhancement of spectral efficiency. Recently, various modulation schemes including pulse amplitude modulation (PAM) [1], pulsewidth modulation (PWM) [2], permutation modulation (PM) [3] and duo-binary signaling [4] have been investigated in high-speed wireline links to increase spectral efficiency. However, multi-level signaling schemes suffer from SNR reduction and tighter linearity requirements when compared to conventional NRZ signaling. In this work, a 20Gb/s serial link transceiver employing a framed-pulsewidth modulation (FPWM) scheme that overcomes the SNR degradation without linearity requirement is presented. The FPWM scheme encodes data at the location and the width of pulses in a frame spanning multiple UIs while maintaining a minimum pulsewidth equal to 1UI. The test-chip achieves a coding gain of 33%, which allows the total throughput of 20Gb/s while keeping the baud rate of 15Gb/s. The equalization core incorporates programmable 3-tap pre-emphasis at the transmitter and a continuous-time linear equalizer (CTLE) at the receiver, to compensate for channel insertion loss of up to 12dB at the baud frequency. The transceiver IC is implemented in 40nm CMOS and consumes 90.6mW from a 0.9V supply.

Original languageEnglish
Title of host publication2018 IEEE International Solid-State Circuits Conference, ISSCC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages270-272
Number of pages3
ISBN (Electronic)9781509049394
DOIs
StatePublished - 8 Mar 2018
Event65th IEEE International Solid-State Circuits Conference, ISSCC 2018 - San Francisco, United States
Duration: 11 Feb 201815 Feb 2018

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume61
ISSN (Print)0193-6530

Conference

Conference65th IEEE International Solid-State Circuits Conference, ISSCC 2018
Country/TerritoryUnited States
CitySan Francisco
Period11/02/1815/02/18

Bibliographical note

Publisher Copyright:
© 2018 IEEE.

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