12×12 packaged digital silicon photonic MEMS switches

Tae Joon Seok; How Yuan Hwang; Jun Su Lee; Alex Forencich; Hannah R. Grant; Dylan Knutson; Niels Quack; Sangyoon Han; Richard S. Muller; Lee Carroll; George C. Papen; Peter O'Brien; Ming C. Wu

doi:10.1109/IPCon.2016.7831260

12×12 packaged digital silicon photonic MEMS switches

Tae Joon Seok
, How Yuan Hwang
, Jun Su Lee
, Alex Forencich
, Hannah R. Grant
, Dylan Knutson
, Niels Quack
, Sangyoon Han
, Richard S. Muller
, Lee Carroll
, George C. Papen
, Peter O'Brien
, Ming C. Wu

Department of Robotics and Mechatronics Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

6 Scopus citations

Abstract

We report on the first electrical and optical packaging of digital silicon photonic MEMS switches with 12×12 ports, 13∼18dB fiber-To-fiber loss, 10^-11 BER for 10-Gb/s datastream, 0.4μs switch reconfiguration time, and <1.6V (5%) switching voltage variations.

Original language	English
Title of host publication	2016 IEEE Photonics Conference, IPC 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	629-630
Number of pages	2
ISBN (Electronic)	9781509019069
DOIs	https://doi.org/10.1109/IPCon.2016.7831260
State	Published - 23 Jan 2017
Event	29th IEEE Photonics Conference, IPC 2016 - Waikoloa, United States Duration: 2 Oct 2016 → 6 Oct 2016

Publication series

Name	2016 IEEE Photonics Conference, IPC 2016

Conference

Conference	29th IEEE Photonics Conference, IPC 2016
Country/Territory	United States
City	Waikoloa
Period	2/10/16 → 6/10/16

Bibliographical note

Publisher Copyright:
© 2016 IEEE.

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10.1109/IPCon.2016.7831260

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Seok, T. J., Hwang, H. Y., Lee, J. S., Forencich, A., Grant, H. R., Knutson, D., Quack, N., Han, S., Muller, R. S., Carroll, L., Papen, G. C., O'Brien, P., & Wu, M. C. (2017). 12×12 packaged digital silicon photonic MEMS switches. In 2016 IEEE Photonics Conference, IPC 2016 (pp. 629-630). Article 7831260 (2016 IEEE Photonics Conference, IPC 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IPCon.2016.7831260

@inproceedings{56e1d5e6e9d44d698a258179b5af9a78,

title = "12×12 packaged digital silicon photonic MEMS switches",

abstract = "We report on the first electrical and optical packaging of digital silicon photonic MEMS switches with 12×12 ports, 13∼18dB fiber-To-fiber loss, 10-11 BER for 10-Gb/s datastream, 0.4μs switch reconfiguration time, and <1.6V (5\%) switching voltage variations.",

author = "Seok, \{Tae Joon\} and Hwang, \{How Yuan\} and Lee, \{Jun Su\} and Alex Forencich and Grant, \{Hannah R.\} and Dylan Knutson and Niels Quack and Sangyoon Han and Muller, \{Richard S.\} and Lee Carroll and Papen, \{George C.\} and Peter O'Brien and Wu, \{Ming C.\}",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 29th IEEE Photonics Conference, IPC 2016 ; Conference date: 02-10-2016 Through 06-10-2016",

year = "2017",

month = jan,

day = "23",

doi = "10.1109/IPCon.2016.7831260",

language = "English",

series = "2016 IEEE Photonics Conference, IPC 2016",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "629--630",

booktitle = "2016 IEEE Photonics Conference, IPC 2016",

}

Seok, TJ, Hwang, HY, Lee, JS, Forencich, A, Grant, HR, Knutson, D, Quack, N, Han, S, Muller, RS, Carroll, L, Papen, GC, O'Brien, P & Wu, MC 2017, 12×12 packaged digital silicon photonic MEMS switches. in 2016 IEEE Photonics Conference, IPC 2016., 7831260, 2016 IEEE Photonics Conference, IPC 2016, Institute of Electrical and Electronics Engineers Inc., pp. 629-630, 29th IEEE Photonics Conference, IPC 2016, Waikoloa, United States, 2/10/16. https://doi.org/10.1109/IPCon.2016.7831260

12×12 packaged digital silicon photonic MEMS switches. / Seok, Tae Joon; Hwang, How Yuan; Lee, Jun Su et al.
2016 IEEE Photonics Conference, IPC 2016. Institute of Electrical and Electronics Engineers Inc., 2017. p. 629-630 7831260 (2016 IEEE Photonics Conference, IPC 2016).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - 12×12 packaged digital silicon photonic MEMS switches

AU - Seok, Tae Joon

AU - Hwang, How Yuan

AU - Lee, Jun Su

AU - Forencich, Alex

AU - Grant, Hannah R.

AU - Knutson, Dylan

AU - Quack, Niels

AU - Han, Sangyoon

AU - Muller, Richard S.

AU - Carroll, Lee

AU - Papen, George C.

AU - O'Brien, Peter

AU - Wu, Ming C.

PY - 2017/1/23

Y1 - 2017/1/23

N2 - We report on the first electrical and optical packaging of digital silicon photonic MEMS switches with 12×12 ports, 13∼18dB fiber-To-fiber loss, 10-11 BER for 10-Gb/s datastream, 0.4μs switch reconfiguration time, and <1.6V (5%) switching voltage variations.

AB - We report on the first electrical and optical packaging of digital silicon photonic MEMS switches with 12×12 ports, 13∼18dB fiber-To-fiber loss, 10-11 BER for 10-Gb/s datastream, 0.4μs switch reconfiguration time, and <1.6V (5%) switching voltage variations.

UR - https://www.scopus.com/pages/publications/85014217652

U2 - 10.1109/IPCon.2016.7831260

DO - 10.1109/IPCon.2016.7831260

M3 - Conference contribution

AN - SCOPUS:85014217652

T3 - 2016 IEEE Photonics Conference, IPC 2016

SP - 629

EP - 630

BT - 2016 IEEE Photonics Conference, IPC 2016

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 29th IEEE Photonics Conference, IPC 2016

Y2 - 2 October 2016 through 6 October 2016

ER -

12×12 packaged digital silicon photonic MEMS switches

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