12×12 packaged digital silicon photonic MEMS switches

Tae Joon Seok; How Yuan Hwang; Jun Su Lee; Alex Forencich; Hannah R. Grant; Dylan Knutson; Niels Quack; Sangyoon Han; Richard S. Muller; Lee Carroll; George C. Papen; Peter O'Brien; Ming C. Wu

doi:10.1109/IPCon.2016.7831260

12×12 packaged digital silicon photonic MEMS switches

Tae Joon Seok, How Yuan Hwang, Jun Su Lee, Alex Forencich, Hannah R. Grant, Dylan Knutson, Niels Quack, Sangyoon Han, Richard S. Muller, Lee Carroll, George C. Papen, Peter O'Brien, Ming C. Wu

Department of Robotics and Mechatronics Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

6 Scopus citations

Abstract

We report on the first electrical and optical packaging of digital silicon photonic MEMS switches with 12×12 ports, 13∼18dB fiber-To-fiber loss, 10^-11 BER for 10-Gb/s datastream, 0.4μs switch reconfiguration time, and <1.6V (5%) switching voltage variations.

Original language	English
Title of host publication	2016 IEEE Photonics Conference, IPC 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	629-630
Number of pages	2
ISBN (Electronic)	9781509019069
DOIs	https://doi.org/10.1109/IPCon.2016.7831260
State	Published - 23 Jan 2017
Event	29th IEEE Photonics Conference, IPC 2016 - Waikoloa, United States Duration: 2 Oct 2016 → 6 Oct 2016

Publication series

Name	2016 IEEE Photonics Conference, IPC 2016

Conference

Conference	29th IEEE Photonics Conference, IPC 2016
Country/Territory	United States
City	Waikoloa
Period	2/10/16 → 6/10/16

Bibliographical note

Publisher Copyright:
© 2016 IEEE.

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10.1109/IPCon.2016.7831260

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Seok, T. J., Hwang, H. Y., Lee, J. S., Forencich, A., Grant, H. R., Knutson, D., Quack, N., Han, S., Muller, R. S., Carroll, L., Papen, G. C., O'Brien, P., & Wu, M. C. (2017). 12×12 packaged digital silicon photonic MEMS switches. In 2016 IEEE Photonics Conference, IPC 2016 (pp. 629-630). Article 7831260 (2016 IEEE Photonics Conference, IPC 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IPCon.2016.7831260

@inproceedings{56e1d5e6e9d44d698a258179b5af9a78,

title = "12×12 packaged digital silicon photonic MEMS switches",

abstract = "We report on the first electrical and optical packaging of digital silicon photonic MEMS switches with 12×12 ports, 13∼18dB fiber-To-fiber loss, 10-11 BER for 10-Gb/s datastream, 0.4μs switch reconfiguration time, and <1.6V (5%) switching voltage variations.",

author = "Seok, {Tae Joon} and Hwang, {How Yuan} and Lee, {Jun Su} and Alex Forencich and Grant, {Hannah R.} and Dylan Knutson and Niels Quack and Sangyoon Han and Muller, {Richard S.} and Lee Carroll and Papen, {George C.} and Peter O'Brien and Wu, {Ming C.}",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 29th IEEE Photonics Conference, IPC 2016 ; Conference date: 02-10-2016 Through 06-10-2016",

year = "2017",

month = jan,

day = "23",

doi = "10.1109/IPCon.2016.7831260",

language = "English",

series = "2016 IEEE Photonics Conference, IPC 2016",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "629--630",

booktitle = "2016 IEEE Photonics Conference, IPC 2016",

}

Seok, TJ, Hwang, HY, Lee, JS, Forencich, A, Grant, HR, Knutson, D, Quack, N, Han, S, Muller, RS, Carroll, L, Papen, GC, O'Brien, P & Wu, MC 2017, 12×12 packaged digital silicon photonic MEMS switches. in 2016 IEEE Photonics Conference, IPC 2016., 7831260, 2016 IEEE Photonics Conference, IPC 2016, Institute of Electrical and Electronics Engineers Inc., pp. 629-630, 29th IEEE Photonics Conference, IPC 2016, Waikoloa, United States, 2/10/16. https://doi.org/10.1109/IPCon.2016.7831260

12×12 packaged digital silicon photonic MEMS switches. / Seok, Tae Joon; Hwang, How Yuan; Lee, Jun Su et al.
2016 IEEE Photonics Conference, IPC 2016. Institute of Electrical and Electronics Engineers Inc., 2017. p. 629-630 7831260 (2016 IEEE Photonics Conference, IPC 2016).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

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AU - Seok, Tae Joon

AU - Hwang, How Yuan

AU - Lee, Jun Su

AU - Forencich, Alex

AU - Grant, Hannah R.

AU - Knutson, Dylan

AU - Quack, Niels

AU - Han, Sangyoon

AU - Muller, Richard S.

AU - Carroll, Lee

AU - Papen, George C.

AU - O'Brien, Peter

AU - Wu, Ming C.

PY - 2017/1/23

Y1 - 2017/1/23

N2 - We report on the first electrical and optical packaging of digital silicon photonic MEMS switches with 12×12 ports, 13∼18dB fiber-To-fiber loss, 10-11 BER for 10-Gb/s datastream, 0.4μs switch reconfiguration time, and <1.6V (5%) switching voltage variations.

AB - We report on the first electrical and optical packaging of digital silicon photonic MEMS switches with 12×12 ports, 13∼18dB fiber-To-fiber loss, 10-11 BER for 10-Gb/s datastream, 0.4μs switch reconfiguration time, and <1.6V (5%) switching voltage variations.

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U2 - 10.1109/IPCon.2016.7831260

DO - 10.1109/IPCon.2016.7831260

M3 - Conference contribution

AN - SCOPUS:85014217652

T3 - 2016 IEEE Photonics Conference, IPC 2016

SP - 629

EP - 630

BT - 2016 IEEE Photonics Conference, IPC 2016

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 29th IEEE Photonics Conference, IPC 2016

Y2 - 2 October 2016 through 6 October 2016

ER -

12×12 packaged digital silicon photonic MEMS switches

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